Objectives
Participants
successfully completing the course are able to identify
and explain:
-
Concepts
of rework and lead-free rework.
-
Areas
of rework affected by transition to lead-free.
-
Defects
more likely to occur with lead-free assembly.
-
Appearance
of acceptable tin/lead and lead-free joints.
-
Care
of soldering equipment and demands of lead-free.
-
Solder
types based on labelling and naming conventions.
-
Role
of flux and the impact of lead-free.
-
Impact
of lead-free on board laminates and finishes.
-
Maintaining
a mixed tin/lead and lead-free facility.
-
Removal,
cleaning, and replacement for through-hole, SMT.
-
Cleaning
procedures after reworking lead-free.
-
Moisture
control in lead-free rework.
-
Challenges
in reworking SMT area-array devices.
-
Optical
and X-ray Inspection for area-array devices.
-
Temperature
issues for area-array devices with lead-free.
Qualification
and Certification Testing
LearnTech®
training incorporates interactive learning checks throughout
the instructional sequences. Certification tests are criterion-referenced
and module-based with feedback on every response for enhanced
learning. The tests also include a scorebar to provide the
learner with continuous status information. Administrative
access to dates and scores of tests, certifications, and re-certifications
is compliant with ISO quality-standards requirements.
Standard
Compliant
This
course applies JEDEC Standard JESD97 for Identification of
Lead(Pb) Free Assemblies, Components, and Devices.
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